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Product Highlights：
OSP with carbon ink technique
Product parameter：
| Layers | 2L board |
| Material | FR-4 |
| Thickness | 1.2mm+/-10% |
| Surface processing | OSP+Carbon ink |
| Copper thickness | 1 oz |
| Drill hole(Min.) | 0.25mm |
| Min. line space | 4mil |
| Min. line width | 4mil |
http://www.ibe-technologies.net/